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  Printed Circuit Materials-Imaging
Silver Film & Chemistries Partners

DuPont Silver Phototools—Now improved for superior vacuum drawdown, scratch resistance, abrasion resistance, and dimensional stability.

  • ImageMaster Red Laser Phototooling Film (IMR)—A step change in fine feature processing with red laser photoplotters.
  • ImageMaster Orthochromatic Phototooling Film (IMO)—Advanced phototooling technology for blue and green laser photoplotters. General contacting and camera use.

Developer for ImageMaster Phototools (D-IM)—Offers consistent processing, a "set-up and leave" operation.

Fixer for ImageMaster Phototools (F-IM)—More environmentally conscious.

The ImageMaster Phototool Processor—For the ImageMaster Phototooling System, Part of the Riston MasterSeries of High Performance Products for Fine Feature Imaging of Printed Wiring Boards.

DuPont Printed Circuit Materials




Diazo Film
Partners

Diazo Film—designed to function as a working master in the manufacture of printed circuit boards. Unlike silver halide films, diazo can be handled in yellow room light and is processed using ammonia vapors and heat.

GMP 2000—features exceptional dye stability which allows for multiple exposures as a phototool. The 7mil base provides excellent thermal stability. Stored under recommended conditions, 70*F/50%Rh, the film is stable for one year.

DuPont Printed Circuit Materials

GMP




Phototool Protective Films
Partners

Filmguard—Thin emulsion protection film providing a tough, durable shield over silver, diazo or glass phototools.

Ultraguard—Provides a superior surface to resist scratches, nicks, and other abrasion damage during the phototool process.

MTH Corporation




Dry Film Resist
Partners

Riston EtchMaster—A highly productive, high resolution acid or alkaline etch resist for large volume and fine line production.

Riston GoldMaster—A specialized gold plating resist with exceptional resistance to harsh plating chemistries coupled with easy stripping.

Riston PlateMaster—The market leading plating resist with consistently high yields and robust processing latitude in copper, tine and tin/lead plating, PlateMaster exhibits outstanding plated line uniformity, fine line resolution and wide surface tolerance.

Riston TentMaster—Specially formulated for high yields in tent-and-etch applications, with wide process latitude from lamination through stripping.

Riston MultiMaster—A general purpose product with exceptional resolution and clean stripping for alkaline etching and all plating.

Riston Technology: The YieldMaster 2000 System—Specifically designed to deliver optimum yields with ZERO capital investment, this unique thin film and lamination system provides superior conformation and high productivity, with excellent etched line quality in acid and alkaline etching applications.

DuPont Printed Circuit Materials




Polymer Thick Film
Partners

DuPont Polymer Thick Film for Printed Wiring Boards—DuPont Microcircuit Materials makes a variety of polymer thick film materials for printed wiring board applications. These include:

  • DuPont CB200 and CB210—EMI Shielding. DuPont Electronic Materials has several new copper-based products and a new carbon product to add to its CB Series Polymer Thick Film (PTF) Pastes. Two of the new copper PTF pastes - CB200 for rigid circuit boards and CB210 for flexible circuits: provide low-cost alternatives for shielding against electro-magnetic interference (EMI) and provide up to 30 percent cost savings compared with traditional EMI shielding options.
  • DuPont CB100—ViaPlug Material for PWB's. This high performance viaplug product line has been developed to planarize high density PWB's, enhance both thermal and electrical conductivity for applications ranging from BGA's, buried vias or PWB's with microvia layers.
  • DuPont ViaPlug for BGA's, Buried Vias and Redistribution—Enhance thermal conductivity through hole, enhance electrical conductivity through hole, lower cost process, no voids within inner-layer, no through hole plating for inner-layer, no tenting of resist over through holes, no possible flow of pre-preg into holes during press-lamination.

DuPont Printed Circuit Materials




Liquid Photo Imageable & Pastes
Partners

Carapace Aqueous Liquid Photoimageable Soldermask—Carapace is a contact exposure, aqueous developing, liquid photoimageable soldermask, sing two-component epoxy technology to give high level of chemical resistance over copper, copper oxide, tin-lead or gold plated circuits.

ED1000 Silver/Carbon Paste for Rigid Substrates—ED1000 pastes are manufactured using high quality carbon and silver powders. They are particularly suitable for use on FR4 material and in applications where temperature stability must be achieved with minimum curing temperature.

ED2000 Silver Paste for Rigid Substrate—ED2000 silver pastes are highly conductive, silver-filled thermosetting conductor pastes suitable for use on rigid substrate. They can be used for printing complete circuits or providing "jumper" connections on conventional circuits where high conductivity is required. They also have a long, hard wearing surface and are suitable for use as sliding contacts.

ED3000 Silver Paste for Flexible Substrate—ED3000 flexible silver pastes are thermoplastic conductive pastes developed specifically for untreated polyester, polymide and polycarbonate films. Typical screen-print applications are flexible circuits and membrane switches.

ED4000 Flexible Carbon Paste for Flexible Substrate—ED4000 flexible carbon pastes are graphite filled conductive overprint ink designed for use with ED3000 silver conductive paste. ED4000 provides excellent protection with the lowest possible resistance. ED4000 are thermoplastic conductive pastes developed specifically for untreated polyester, polymide and polycarbonate films.

ED5000 Carbon Paste for Rigid Substrate—ED5000 is a screenprintable conductive carbon filled polymer paste for the protection of copper contacts or for printing conductive tracks. It is designed to eliminate the problems and costs associated with selective nickel/gold electroplating while maintaining a corrosion free conductive surface. It can also be used for printing crossover linkages on circuit boards as an alternative to jumper wires or through hole plating. ED5000 provides a corrosion resistance comparable to gold, a hard durable surface to withstand many insertions and contacts, as well as the commonly used soldering operations as wave soldering and hot air solder leveling.

ED6000 Carbon Paste for Rigid Substrate—ED6000 is designed to offer all the advantages and cost savings of ED5000 with the added advantage of epoxy based chemistry. This offers a high surface hardness and an extremely wear resistant surface, making it deal for sliders, potentiometers and multi-insertion connectors

ED7000 Carbon Resistor Paste for Rigid Substrates—ED7000 carbon resistor pastes are manufactured using high quality carbon and graphite powders to give a wide range of values. They are suitable for producing both fixed (discrete) and variable (potentiometers) resistors and are used in both commercial and automotive applications. They are suitable for use on FR4 material, particularly in applications where temperature stability must be achieved in conjunction with minimum cure temperature.

ED8000 Dielectric Pastes—ED8000 is a range of thermal and UV insulation/dielectric pastes for both rigid and flexible substrates. They are designed to be used with other Electrador products.

ED9000 Flexible Carbon Resistor Pastes for Flexible Substrate—ED9000 is a range of thermoplastic resistor pastes designed for use on flexible circuits/membrane switches. They are suitable for use on polyester, polymide, polycarbonate and ABS substrates.

Electra




Liquid Photo Imageable & Pastes
 

Stouffer Step Tablets—Around the world the Stouffer 21-step Transparent Guide serves as a gauge to evaluate the variables encountered in the exposure and processing of lithographic plates and photographic materials by contact. It indicates the direction and magnitude of exposure or processing adjustments necessary to achieve the desired results. It is also used with contact positives, silk screen, printed circuit boards, and most other photographic applications for judging results, determining speed and contrast of emulsions, and hardness of coatings.

Eye Loupes—Available in various sizes and magnifications.

3M brand No. 5800 Clean-Walk Mats—Remove dirt and contaminants from the bottom of shoes, wheels and other passing objects with 3M brand No. 5800 Clean-Walk Mats. These adhesive floor mats are an easy way to maintain your standards of cleanliness in your work area, because they remove dust and dirt on contact. 3M mats are long lasting too. When the top sheet becomes soiled, simply peel it back to reveal clean adhesive sheet underneath.

Tacky Rollers and Pads—The Etcho 9.5" x 13" Tacky Pad with 50 disposable sheets, cleans dust, chips and microscopic contaminants from dirty rollers.

Lite and Dry Tack Clothes—Best for use on glass, plastics and highly polished surfaces or where very warm surface temperature may be encountered upon application.

Film Punches—Burgess (formerly Carlson) and Stoesser. Call for quote.

Glass and Film Cleaners—High-performance aerosols formulated for the needs of screen printers.

Light Tables—Nuarc and Federal Graphics. Call for quote.

Touch-up Pens—Blue, Red, Black, Medium and Fine Pens. Pens are available in four sizes and three colors.

Film Storage Envelopes—Tyvek, Foster, Rocconex, and Jalema.

 

   
 
 





Etchomatic Celebrates 50 Years!